Excellent dimensional stability and surface smoothness! Expansion into high-density semiconductor package substrates is possible.
"Zenomax®" is a high-temperature resistant polyimide film manufactured by Zenomax Japan Co., Ltd., a joint venture between Toyobo Co., Ltd. and Nagase & Co., Ltd.
It possesses the highest level of dimensional stability and high heat resistance among polymer films, making it suitable for applications such as alternatives to glass, silicon wafers, ceramics, and metals, as well as for composites.
Leveraging features such as "thin, flexible, lightweight, unbreakable, and easy to process," it can be applied to thin-film transistor substrates that are becoming lighter, thinner, and larger, as well as to semiconductor package substrates that are becoming more densely packed.
[Features]
■ Excellent dimensional stability: Comparable to glass, silicon wafers, and ceramics (linear expansion coefficient 0–3 ppm/K)
■ High heat resistance: Maintains flatness at 500°C (no warping or deformation)
■ Excellent surface smoothness: Comparable surface smoothness to display glass substrates (Ra ≈ 0.5 nm)
